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09/11/2011
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Today's vehicles have an increasing number of ECUs with expanding levels of electronic complexity and heat generation. Materials manufacturer, Momentive, has introduced Silcool XE13-C1862PT adhesive, to enhance the dissipation of heat generated by the electronics. As a result the ECU's are made more reliable and premature failure is prevented.
 According to Andy Briars, Technical Director at Momentive's distribution partner, Techsil, "A key design requirement of many Electronic Control Units (ECU's) is high-performance heat dissipation to ensure efficient operation and protection of sensitive components. As higher operating temperatures are generated by increasingly small systems and rising circuit densities, efficient thermal management solutions are in high demand. Heat generating microprocessors are commonly mounted on ceramic or metal-core PCBs to increase thermal transfer efficiency. These PCBs are attached to a heat sink by a thermally conductive adhesive such as Momentive's Silcool XE13-C1862PT"
Silcool XE13-C1862PT is a one-component, heat curable silicone adhesive designed for applications where thermal conductivity is required. The product cures quickly with heat and adheres well to a variety of substrates without the use of a primer and has a typical thermal conductivity of 2.5 W/m.K. In addition, the product is a flowable material that can be applied in a variety of ways, eg. basic dispensing, pin-transfer and screen-printing, so it is easy work with in an industrial setting.
Compared to other competitive TIM adhesives with a similar level of thermal conductivity, Silcool XE13-C1862PT has a higher level of flexibility that can be seen in its typical elongation at break level of 80%. This property allows the Bond Line Thickness (BLT) to be reduced to a level of 50-70 microns. Its flexibility also helps compensate for mechanical movement induced by thermal cycling and Co-efficient of Thermal Expansion (CTE) differences between the heat sink and PCB materials. Furthermore, since thermal resistance is proportional to the thickness of the material through which the heat must travel, this BLT reduction results in reduced thermal resistance of the overall construction, improving the reliability and preventing premature failure of ECUs in the field.
Mr. Mark Fraser, Regional Marketing Manager Automotive Electronics at Momentive comments, "We are pleased with how quickly our thermal management solutions are gaining acceptance among automotive tier 1 manufacturers. With products such as our Silcool XE13-C1862PT, we are helping them to achieve the high performance levels required by OEMs without compromising on productivity which is so important to the industry as a whole".
For more information visit Techsil's website and download a technical datasheet CLICK HERE
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Author
Techsil Ltd
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